Physical Analysis
Type: 2FF (Mini-SIM)
Carrier: Claro
State: Destroyed/non-functional
Integrated circuit: Missing
Printed markings:
8950S
21225
20437
2537F
These markings are manufacturing or inventory codes, not the SIM's IMSI, ICCID, or authentication keys.
Reverse Engineering
A normal SIM contains:
CPU (8/16/32-bit secure microcontroller)
ROM containing the SIM operating system
EEPROM/Flash
Hardware cryptographic engine
True random number generator
Security fuses
Gold contact pads
The gold pads normally connect to:
Contact Function
VCC Power
RST Reset
CLK Clock
GND Ground
I/O Serial communication
VPP Programming (obsolete)
RFU Reserved
In your photos:
The gold pads are gone.
The silicon die has been removed.
No electrical traces remain.
There is nothing left that can communicate with a reader.
What Data Would Have Been Inside
If intact, the chip would contain:
ICCID (SIM serial number)
IMSI (subscriber identity)
Ki authentication key (never readable normally)
Phonebook
SMS storage
Preferred network list
Operator settings
SIM Toolkit applications
Can Anything Be Recovered?
From what is visible:
IMSI: No
Phone number: No
SMS: No
Contacts: No
Authentication key (Ki): No
Carrier provisioning: No
Recovery would only be possible if the silicon chip itself still existed and had not been physically destroyed. Even then, extracting the Ki generally requires invasive semiconductor laboratory techniques costing tens of thousands of dollars.
Manufacturing
The remaining plastic carrier was injection molded and the secure chip module was bonded into the rectangular opening using epoxy and microscopic gold bond wires.
Typical chip size:
Approximately 3 × 4 mm
Silicon thickness around 180–300 µm ← Back to Fiveo1