Physical Analysis Type: 2FF (Mini-SIM) Carrier: Claro State: Destroyed/non-functional Integrated circuit: Missing Printed markings: 8950S 21225 20437 2537F These markings are manufacturing or inventory codes, not the SIM's IMSI, ICCID, or authentication keys. Reverse Engineering A normal SIM contains: CPU (8/16/32-bit secure microcontroller) ROM containing the SIM operating system EEPROM/Flash Hardware cryptographic engine True random number generator Security fuses Gold contact pads The gold pads normally connect to: Contact Function VCC Power RST Reset CLK Clock GND Ground I/O Serial communication VPP Programming (obsolete) RFU Reserved In your photos: The gold pads are gone. The silicon die has been removed. No electrical traces remain. There is nothing left that can communicate with a reader. What Data Would Have Been Inside If intact, the chip would contain: ICCID (SIM serial number) IMSI (subscriber identity) Ki authentication key (never readable normally) Phonebook SMS storage Preferred network list Operator settings SIM Toolkit applications Can Anything Be Recovered? From what is visible: IMSI: No Phone number: No SMS: No Contacts: No Authentication key (Ki): No Carrier provisioning: No Recovery would only be possible if the silicon chip itself still existed and had not been physically destroyed. Even then, extracting the Ki generally requires invasive semiconductor laboratory techniques costing tens of thousands of dollars. Manufacturing The remaining plastic carrier was injection molded and the secure chip module was bonded into the rectangular opening using epoxy and microscopic gold bond wires. Typical chip size: Approximately 3 × 4 mm Silicon thickness around 180–300 µm